CES 2027 | LAS VEGAS | JANUARY 6 TO 9 | LVCC WEST HALL, BOOTH #4577
TAIWAN PAVILION:
BUILDING THE SMART
VEHICLE AS ONE
Eight technology companies, one booth at CES 2027. Cameras, depth sensing, edge AI, central compute, cockpit electronics, automotive memory, SiC power and over-the-air software, from the supply chain that already builds much of the world's electronics. Come meet them in Las Vegas.
ONE PROBLEM, EIGHT PIECES OF THE ANSWER
Cars are turning into computers on wheels, and robots are learning to find their own way through warehouses, farms and streets. Every one of these machines now has to see its surroundings, think in real time, remember what it sensed, run on efficient power and keep improving through software, at automotive grade and for a decade or more of service. Doing that while memory prices swing and supply chains are redrawn is the hard part. The eight companies in the Taiwan Pavilion each solve one piece of it.
SEE AND THINK
oToBrite and eYs3D supply the cameras and 3D depth sensing. MICROIP, Pegatron and Kinpo turn that data into decisions with edge AI systems, central compute and smart cockpit platforms.
REMEMBER AND POWER
ESMT supplies automotive-grade DRAM and Flash with long-term supply commitments. Sentec builds the ceramic substrates and SiC power modules that make electric drivetrains efficient.
KEEP IMPROVING
Carota keeps vehicles current after they leave the factory, with over-the-air software updates, remote diagnostics and AI fleet management already running on more than six million vehicles.
SEE | THINK | REMEMBER | POWER | UPDATE
MEET THE EIGHT EXHIBITORS
Not traveling to the show? Each exhibitor page also lets you set up a call or an email exchange with the team.
BOOTH A | OTOBRITE
AUTOMOTIVE-GRADE VISION
GMSL2 automotive cameras and 3D stereo vision modules for robots, AMRs and unmanned vehicles, from a vision AI company that has shipped more than 1.2 million automotive cameras.
BOOTH C | PEGATRON
VEYON CENTRAL COMPUTE
VEYON, a unified cockpit and sensing platform that runs displays, infotainment and ADAS sensing on one central computer, from one of the largest electronics manufacturers in the world.
BOOTH E | SENTEC
SIC POWER MODULES
Ceramic substrates, SiC power module packaging and testing, and integrated motor and inverter systems for electric drivetrains.
BOOTH G | KINPO
SMART COCKPIT AND RADAR
An ARM-based smart cockpit platform, mmWave radar, camera monitoring systems and digital clusters, built by an OEM/ODM with 16 production bases.
BOOTH B | ESMT
AUTOMOTIVE MEMORY
AEC-Q100 qualified DRAM, LPDDR and Flash memory with 7 to 10 year supply commitments, plus aiPIM processing-in-memory for edge AI.
BOOTH D | CAROTA
OTA AND FLEET AI
Automotive over-the-air software updates, remote diagnostics and AI fleet management, already deployed on more than six million vehicles.
BOOTH F | MICROIP
EDGE AI SYSTEMS
Automotive-grade edge AI vehicle systems and CATS custom ASIC design services that bring AI inference into the vehicle.
BOOTH H | EYS3D
3D DEPTH SENSING
Stereo and ToF depth cameras, the eSP936 multi-sensor controller IC and XINK Nano edge AI modules for robots and smart machines.
SEE YOU IN LAS VEGAS
Taiwan Mobility Pavilion, LVCC West Hall, Booth #4577, CES 2027, January 6 to 9. Eight exhibitors, Booths A to H, in one place. Not traveling to the show? Each exhibitor page also lets you set up a call or an email exchange with the team.
INTELLIGENT MOBILITY · TAIWAN PAVILION · CES 2027
