CES 2027 | TAIWAN PAVILION | LVCC WEST HALL, BOOTH #4577
SIC POWER MODULES, BUILT
FROM THE SUBSTRATE UP
Sentec makes the high conductivity ceramic substrates, packages Si, GaN and SiC power modules as a turnkey OSAT, and integrates motors with their inverters, with deep automotive manufacturing experience.
Sentec E&E is a global electronics and mechatronics manufacturer supplying the automotive industry since 1968. Their Electro Ceramic group provides turnkey power module packaging (Si, GaN, SiC) and high-conductivity substrates, while the Mechatronics Foundry co-designs and validates integrated motor and inverter units. Are you sourcing EV or industrial power modules and e-drive components?
HIGH HEAT SUBSTRATES
AMB silicon nitride at 90 and 130 W/mK, ECC aluminum nitride at 170 W/mK and ultra thin alumina zirconia DBC above 800 MPa, plus hermetic LTCC for RF modules and ceramic in board designs.
TURNKEY POWER MODULE OSAT
Level 1 and 2 packaging for Si, GaN and SiC: SMT and vacuum reflow, solder, gold tin or silver sintered die attach, wire, ribbon and copper clip bonding, flip chip, gold tin hermetic sealing, potting and molding.
MOTOR PLUS INVERTER
Co-design and foundry production of integrated motor and controller modules, from magnet and electrical steel selection and electromagnetic and thermal simulation to dynamometer testing at up to 20,000 rpm and 226 Nm.
CERAMIC SUBSTRATES | POWER MODULE OSAT | MOTOR AND INVERTER | EMISSION CONTROL
BOOK YOUR MEETING WITH SENTEC
Takes under a minute. Tell us how you would like to connect: a call, an email, or in person at CES 2027 in Las Vegas, January 6 to 9. The Sentec team will follow up to set a time.
Sentec at CES 2027: Booth E, Taiwan Mobility Pavilion, LVCC West Hall, Booth #4577, Las Vegas, January 6 to 9, 2027. Product photos: Sentec. The hero image is an AI-generated concept.
INTELLIGENT MOBILITY · TAIWAN PAVILION · CES 2027
