CES 2027 | TAIWAN PAVILION | LVCC WEST HALL, BOOTH #4577
DEPTH SENSING AND EDGE AI
FOR MACHINES THAT MOVE
eYs3D designs the chips behind 3D vision, stereo and ToF depth processors, a seven-sensor controller IC and the eCV edge AI SoC, and ships them as XINK cameras and compute modules for unmanned vehicles, robots and smart parking.
eYs3D Microelectronics designs 3D sensing silicon and edge AI SoCs. Their XINK product family—including depth cameras, compute modules, and the XINK CONNECT fleet platform—equips autonomous robots, drones, and smart parking systems with 3D vision. Their award-winning XINK Nano currently drives EV charging enforcement in Taiwan. At CES 2027, eYs3D seeks mobility OEMs, Tier 1s, and system integrators needing depth sensing and edge AI built from the chip up.
SEVEN SENSORS, ONE IC
The eSP936 multi-sensor controller synchronizes up to seven visual sensors over MIPI and USB, producing 2D images and 3D depth maps with built-in DRAM, wide-angle de-warping and compression. It anchors the YX9670 navigation kit for unmanned vehicles, with a 278-degree panoramic view, AHRS and thermal imaging.
STEREO AND TOF DEPTH
XINK SENSE stereo cameras (G120, G100+, R77, G62) deliver 1280x720 depth from 10 cm to 1.9 m with global shutter options, USB and MIPI interfaces, and an SDK for Windows, Linux, Python and ROS, plus a hybrid ToF module for precision depth at range.
EDGE AI AT THE CURB
XINK Nano, built on the eCV4 SoC with dual Cortex-A55 cores and an NPU, fuses RGB and ToF to run YOLOv8 and pose models locally. A leading Taiwan EV charging brand already uses it for parking space status, license plate recognition and charging bay enforcement.
DEPTH CAMERAS | ESP936 SENSOR IC | XINK NANO EDGE AI | FLEET OTA
BOOK YOUR MEETING WITH EYS3D
Takes under a minute. Tell us how you would like to connect: a call, an email, or in person at CES 2027 in Las Vegas, January 6 to 9. The eYs3D team will follow up to set a time.
eYs3D at CES 2027: Booth H, Taiwan Mobility Pavilion, LVCC West Hall, Booth #4577, Las Vegas, January 6 to 9, 2027. Images: eYs3D Microelectronics and XINK.
INTELLIGENT MOBILITY · TAIWAN PAVILION · CES 2027
